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Wafer Surface Defect Detection Based on Improved Autoencoder and Deep Feature Extractor
更新时间：2024-10-14
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    • Wafer Surface Defect Detection Based on Improved Autoencoder and Deep Feature Extractor

    • “在半导体缺陷检测领域，研究人员提出了一种基于改进自编码器和深度特征提取器的晶圆表面缺陷检测模型，有效提升了缺陷检测精度。”
    • Software Guide   Vol. 23, Issue 10, Pages: 48-54(2024)

    • DOI：10.11907/rjdk.241392    

      CLC： TP391.4

    • Published：15 October 2024，

      Received：22 April 2024，

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  • LING Hongwei,ZHANG Jianmin.Wafer Surface Defect Detection Based on Improved Autoencoder and Deep Feature Extractor[J].Software Guide,2024,23(10):48-54. DOI： 10.11907/rjdk.241392.

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